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Xiaomi came up with its new laptop model Xiaomi Book 14 today. The new Xiaomi Book, which offers two options on the hardware side, is powered by Intel processors and promises high features on the screen side. Here are all the features of Xiaomi Book 14.

Xiaomi Book 14 comes with Intel i3 and i5 processors!

Xiaomi announced its new laptop Xiaomi Book 14 today. As the name suggests, the new Xiaomi Book, which comes with a 14-inch screen, offers 2.8K resolution on this screen. The screen has a 120Hz refresh rate, 100 percent sRGB colour and 300 nits brightness.

Offering two hardware options, Xiaomi uses Intel’s i5-12500H processor in the top version. Supporting this processor with 16 GB LPDDR5 RAM memory, the Chinese company also places a 512 GB PCIe 4.0 SSD in the device. In the other version, Intel’s i3-1220P CPU is preferred. Xiaomi, which places 8 GB LPDDR5 RAM on the motherboard with this processor, offers a slightly more limited storage space with 256 GB PCIe 4.0 SSD.

Xiaomi uses 56 Wh battery in both models, thus offering 12 hours of battery life in the new Book 14 models. In addition, the company also places HDMI 2.1 and USB-C 3.2 Gen 2 ports on the devices and offers features such as WiFi 6 and Bluetooth 5.2 to users with Xiaomi Book 14. Xiaomi Book 14, which weighs a total of 1.37 kilograms with all these features, works with Windows 11 Home operating system. Prices are unknown for now.

Specifications of Xiaomi Book 14!

FeaturesTop VersionLower Version
ProcessorIntel i5-12500HIntel i3-1220P
RAM Memory16 GB LPDDR58 GB LPDDR5
Storage512 GB PCIe 4.0 SSD256 GB PCIe 4.0 SSD
Screen14-inch, 2.8K resolution, 120Hz refresh rate14-inch, 2.8K resolution, 120Hz refresh rate
Brightness300 nit300 nit
Battery Capacity56 Wh56 Wh
Connection PointsHDMI 2.1, USB-C 3.2 Gen 2HDMI 2.1, USB-C 3.2 Gen 2
Wireless ConnectionWiFi 6, Bluetooth 5.2WiFi 6, Bluetooth 5.2
Operating SystemWindows 11 HomeWindows 11 Home
Weight1,37 kg1,37 kg
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Hardware news and contents

iPhone 17’s A19 Chip Will Not Be 2 nm

A reliable source regarding leaks claimed that the A19 processor to be used in the iPhone 17 will not be produced with the 2 nm process.

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A reliable source regarding leaks claimed that the A19 processor to be used in the iPhone 17 will not be produced with the 2 nm process.

According to reports in the past weeks, TSMC will start mass production with the 2 nm process in 2025 and iPhone 17It was said that the A19 chip that will power the models will be 2 nm. A user named ‘Mobile chip expert’ on Weibo stated that these news were ridiculous and explained that the media misled people. According to the source, a 3 nm chipset will be used in the iPhone 17 series. The mobile chip expert has a good track record, and much of the information he previously shared turned out to be accurate.

iphone 17

The A18 processor will power the iPhone 16 series, which is expected to be released in September. Identifying model numbers were found in code recently discovered in Apple’s backend. These numbers show that all new iPhones will have the A18 chip. Rumor has it that the A18 chip will include a 6-core GPU. According to rumors, Apple will stick to the 6-core GPU and the new chipset will have more limited improvements on the graphics side. On the other hand, it is stated that the A18 will have an advanced Neural Engine with more cores.

Apple has been using a 16-core Neural Engine since the iPhone 12. So far, the core count of the Neural Engine has not changed, but its performance has changed a lot over the years. If the rumors are true, the Cupertino company will increase the number of cores in Neural Engine after many years. Analyst Jeff Pu said in his previous research report that A18 will have a large mold area. According to Jeff Pu, the larger die area is related to the Neural Engine. Increasing die area on a chip generally results in higher performance. On the other hand, as the mold size increases, the risks of defects and design errors also increase. Energy efficiency and heat dissipation may also be affected.

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Hardware news and contents

INVADER X Launches BTF Mid-Tower Case 1

Following the success of the award-winning original INVADER X case, XPG aims to introduce reverse connector motherboard compatibility to its users in this new version.

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Following the success of the award-winning original INVADER X case, XPG aims to introduce reverse connector motherboard compatibility to its users in this new version.

As one of the first members of the ASUS BTF ALLIANCE, INVADER X BTF aims to offer an aesthetic and flawless appearance with its ocean-themed tempered glass panels and completely hidden cables. In addition to ATX BTF compatibility, this case promises superior cooling performance by supporting a total of ten 120mm fans, five of which are pre-installed.

INVADER

ASUS BTF ALLIANCE

ASUS BTF ALLIANCE is a collaboration platform developed to run various hardware components harmoniously and seamlessly. “Back to the Future” BTF, an abbreviation for the phrase, uses motherboards and components with reverse connectors, making cable management easier and system setup tidier. It offers aesthetically and performance-compatible components, uses advanced cooling solutions and aims to improve the user experience.

Ergonomic Design, Superior Performance

INVADER This stylish and functional case fits behind the motherboard plate with a removable storage bracket. up to three 3.5” or 2.5” hard drives allows you to mount it. It also offers the ability to completely remove the bracket for users upgrading to an M.2 SSD. Thanks to the embedded cable channel and internal straps, you can easily hide the cables and give your system a tidy and aesthetic appearance.

INVADER

INVADER x BTF, Compatible with vertical and horizontal graphics cards up to 400mm in length and comes with a vertical bracket. Adopting the new reverse connector conventions of ASUS BTF ALLIANCE components, this case with front and side 3mm tempered glass panels It makes your system look stunning from every angle.

INVADER four pre-installed 120mm ARGB reverse blade fans and one standard 120mm ARGB fan It also helps them stay cool. With space reserved for a 360mm radiator on top up to ten fans in total This case, which offers support, aims to be an ideal solution with its superior cooling performance.

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MediaTek announces new Dimensity 7350 chipset

MediaTek introduced its latest chipset, Dimensity 7350, designed to deliver powerful performance for mid-range devices. Although it does not offer high-end performance, phones equipped with Dimensity 7350 are expected to come at a budget-friendly price.

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MediaTek introduced its latest chipset, Dimensity 7350, designed to deliver powerful performance for mid-range devices. Although it does not offer high-end performance, phones equipped with Dimensity 7350 are expected to come at a budget-friendly price.

Dimensity 7350 has an 8-core structure produced using TSMC’s 2nd generation 4nm manufacturing process. The chipset includes 2nd generation Armv9 processors capable of reaching speeds of up to 3.0 GHz and G610 MC4 GPU for graphics processing.

Kernel Configuration:

  • 2 x Cortex-A715 cores
  • 6 x Cortex-A510 cores

Dimensity 7350

Other Features:

  • MediaTek NPU 657 for AI tasks
  • Imagiq 765 ISP supporting 14-bit HDR images
  • Capable of handling camera sensors up to 200 MP
  • Ability to record 4K videos at 30 FPS
  • Support for both LPDDR5 and LPDDR4x RAM

Dimensity 7350 has some limitations. chipset, Only It supports Full HD+ displays at 144 Hz and uses UFS 3.1 storage. Therefore, it is unlikely to see this chipset in high-end smartphones.

The chipset offers a powerful and affordable option for mid-range devices. Phones equipped with this chipset will provide sufficient performance in daily use and appeal to a wide range of users with their affordable prices. While this new chipset from MediaTek increases the performance of mid-range devices, it also attracts attention with its budget-friendliness.

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