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Apple’s plans for the new iPad Pro and iPad Air models seem to have changed. A fresh report claims that the release date has been pushed a little further.

Mark Gurman, whose many posts about Apple turned out to be true, is the new generation iPad Pro He stated that the and iPad Air models will be introduced in early May. Gurman said that Apple postponed the launch, that OLED iPad Pros are produced with complex techniques, and this also contributed to the delay. Gurman also added that the technology giant is trying to finish the software for new devices. Mark Gurman had previously suggested that new tablets would be released in late March or early April. It was also claimed on Weibo that the new iPads will be released around May. As a result, two different sources show May as the new date. Of course, it is unclear what the Cupertino company will do.

ipad pro

The most striking part of the 2024 model iPad Pro will be the OLED screen. OLED offers natural black and more vibrant colors compared to LED or mini-LED. It also consumes more power. In addition, the new Pro tablets may be thinner than the Pro tablets with LED screens currently on the market. Apple is expected to use OLED later on the iPad Air and iPad mini. We may also see the first MacBook with OLED by the end of next year.

Sources close to Apple’s supply chain also claimed that the new Pro tablets will be sold with a 4 TB storage option. The 2021 model iPad Pros on sale have 128 GB, 256 GB, 512 GB, 1 TB and 2 TB storage options. 4 TB was mentioned again in old reports, but some claims said that Apple had given up on 4 TB. New rumors emphasize again that glass may be used on the back of the 2024 model Pro tablets. If this is true, it will be a significant change.

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Hardware news and contents

iPhone 17’s A19 Chip Will Not Be 2 nm

A reliable source regarding leaks claimed that the A19 processor to be used in the iPhone 17 will not be produced with the 2 nm process.

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A reliable source regarding leaks claimed that the A19 processor to be used in the iPhone 17 will not be produced with the 2 nm process.

According to reports in the past weeks, TSMC will start mass production with the 2 nm process in 2025 and iPhone 17It was said that the A19 chip that will power the models will be 2 nm. A user named ‘Mobile chip expert’ on Weibo stated that these news were ridiculous and explained that the media misled people. According to the source, a 3 nm chipset will be used in the iPhone 17 series. The mobile chip expert has a good track record, and much of the information he previously shared turned out to be accurate.

iphone 17

The A18 processor will power the iPhone 16 series, which is expected to be released in September. Identifying model numbers were found in code recently discovered in Apple’s backend. These numbers show that all new iPhones will have the A18 chip. Rumor has it that the A18 chip will include a 6-core GPU. According to rumors, Apple will stick to the 6-core GPU and the new chipset will have more limited improvements on the graphics side. On the other hand, it is stated that the A18 will have an advanced Neural Engine with more cores.

Apple has been using a 16-core Neural Engine since the iPhone 12. So far, the core count of the Neural Engine has not changed, but its performance has changed a lot over the years. If the rumors are true, the Cupertino company will increase the number of cores in Neural Engine after many years. Analyst Jeff Pu said in his previous research report that A18 will have a large mold area. According to Jeff Pu, the larger die area is related to the Neural Engine. Increasing die area on a chip generally results in higher performance. On the other hand, as the mold size increases, the risks of defects and design errors also increase. Energy efficiency and heat dissipation may also be affected.

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INVADER X Launches BTF Mid-Tower Case 1

Following the success of the award-winning original INVADER X case, XPG aims to introduce reverse connector motherboard compatibility to its users in this new version.

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Following the success of the award-winning original INVADER X case, XPG aims to introduce reverse connector motherboard compatibility to its users in this new version.

As one of the first members of the ASUS BTF ALLIANCE, INVADER X BTF aims to offer an aesthetic and flawless appearance with its ocean-themed tempered glass panels and completely hidden cables. In addition to ATX BTF compatibility, this case promises superior cooling performance by supporting a total of ten 120mm fans, five of which are pre-installed.

INVADER

ASUS BTF ALLIANCE

ASUS BTF ALLIANCE is a collaboration platform developed to run various hardware components harmoniously and seamlessly. “Back to the Future” BTF, an abbreviation for the phrase, uses motherboards and components with reverse connectors, making cable management easier and system setup tidier. It offers aesthetically and performance-compatible components, uses advanced cooling solutions and aims to improve the user experience.

Ergonomic Design, Superior Performance

INVADER This stylish and functional case fits behind the motherboard plate with a removable storage bracket. up to three 3.5” or 2.5” hard drives allows you to mount it. It also offers the ability to completely remove the bracket for users upgrading to an M.2 SSD. Thanks to the embedded cable channel and internal straps, you can easily hide the cables and give your system a tidy and aesthetic appearance.

INVADER

INVADER x BTF, Compatible with vertical and horizontal graphics cards up to 400mm in length and comes with a vertical bracket. Adopting the new reverse connector conventions of ASUS BTF ALLIANCE components, this case with front and side 3mm tempered glass panels It makes your system look stunning from every angle.

INVADER four pre-installed 120mm ARGB reverse blade fans and one standard 120mm ARGB fan It also helps them stay cool. With space reserved for a 360mm radiator on top up to ten fans in total This case, which offers support, aims to be an ideal solution with its superior cooling performance.

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Hardware news and contents

MediaTek announces new Dimensity 7350 chipset

MediaTek introduced its latest chipset, Dimensity 7350, designed to deliver powerful performance for mid-range devices. Although it does not offer high-end performance, phones equipped with Dimensity 7350 are expected to come at a budget-friendly price.

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MediaTek introduced its latest chipset, Dimensity 7350, designed to deliver powerful performance for mid-range devices. Although it does not offer high-end performance, phones equipped with Dimensity 7350 are expected to come at a budget-friendly price.

Dimensity 7350 has an 8-core structure produced using TSMC’s 2nd generation 4nm manufacturing process. The chipset includes 2nd generation Armv9 processors capable of reaching speeds of up to 3.0 GHz and G610 MC4 GPU for graphics processing.

Kernel Configuration:

  • 2 x Cortex-A715 cores
  • 6 x Cortex-A510 cores

Dimensity 7350

Other Features:

  • MediaTek NPU 657 for AI tasks
  • Imagiq 765 ISP supporting 14-bit HDR images
  • Capable of handling camera sensors up to 200 MP
  • Ability to record 4K videos at 30 FPS
  • Support for both LPDDR5 and LPDDR4x RAM

Dimensity 7350 has some limitations. chipset, Only It supports Full HD+ displays at 144 Hz and uses UFS 3.1 storage. Therefore, it is unlikely to see this chipset in high-end smartphones.

The chipset offers a powerful and affordable option for mid-range devices. Phones equipped with this chipset will provide sufficient performance in daily use and appeal to a wide range of users with their affordable prices. While this new chipset from MediaTek increases the performance of mid-range devices, it also attracts attention with its budget-friendliness.

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