Analyst Ming-Chi Kuo, nicknamed the Apple Oracle, said that iPad Pro with M5 are on the way and also announced when they will enter mass production. Here are the details…

Ming-Chi Kuo, one of the reliable sources about Apple, said that the new generation with M5 chip iPad ProHe stated that the vehicles will enter production in the second half of 2025. Chinese BYD Electronics will assemble the new iPad Pros. Kuo also stated that BYD Electronics will also be the supplier of the new HomePod model with a screen, which is claimed to be released at the end of 2025. iPad Pros with OLED screens, released last May, were the first devices to use the M4 processor.

South Korean media The Elec reported that Apple ordered the M5 chip from TSMC. M5 chips will have advanced ARM architecture and will be produced with TSMC’s 3 nm process. The M4 series is also produced with the 3 nm process, but TSMC developed the 3 nm process with improvements in production technology. For a while, it was said that the M5 series would be produced with 2 nm technology. Apple probably gave up on this due to cost. It seems that the technology giant will wait another year or so to use the 2 nm process in the A and M series chips. M5 chips will use TSMC’s System on Integrated Chip, or SoIC technology for short. SoIC means integrating multiple systems within a chip. The processor, memory and most other parts are combined on a single chip.

There was a rumor that the new generation iPad Pro would be released with the M6 ​​processor, not the M5. However, with Ming-Chi Kuo’s statement, this claim is also refuted. This is all that has been said for now. We will continue to share new information with you as we receive it.

Lenovo first Windows portable gaming PC Legion Go After over a year of waiting, after launching with premium features like 144Hz QHD+ display, AMD’s Ryzen Z1 series chipsets, and detachable controllers, Legion Go S introduced its second generation model called.

The Legion Go S sports a more mainstream design, compatible with ROG Ally and Steam Deck, in official renders published by Windows Central. Instead of the removable controllers found in the first model, this feature has been removed in Legion Go S. Instead, the screen of the device may be slightly smaller compared to the Legion Go, which improves the ergonomics of use while increasing portability.

The 18-button configuration, equipped with standard ABXY buttons on the right side, dual joysticks with RGB illumination, a D-pad and a protrusion similar to the TrackPoint on Lenovo laptops, enriches the user experience. Additionally, the Legion Go S comes with additional features such as dual front speakers, rear fans, and dual USB-C ports. These ports are positioned on the top of the device, offering a more streamlined and convenient connection.

According to recent leaks, the Legion Go S will be equipped with AMD’s Ryzen Z2 chipset (Rembrandt). This chipset is one step below the Z1 Extreme chip and has Zen 3-plus cores. Ryzen Z2 offers a more balanced performance compared to the Zen 4 cores used in Legion Go and ROG Ally. In this way, Legion Go S promises a superior experience in games and multitasking that require high performance.

Legion Go S is offered as a more affordable option. According to new leaks, the price of the device will be in the range of $ 399-449. This is a significant drop from the $699/€799 starting price of the first model, the Legion Go. This pricing supports Lenovo’s goal of offering a more accessible portable gaming PC to a wide range of users.

Legion Go S is equipped with a 6.85-inch QHD + AMOLED screen and offers sharp and fluid images thanks to its 144Hz refresh rate and high peak brightness. While the resolution and refresh rate of the screen provide a superior visual experience in games, it offers vivid colors and deep contrasts thanks to AMOLED technology.

Legion Go S supports multimedia experience as well as gaming performance. Device, double front speaker and provides high quality sound output with advanced audio technologies. These features offer the user a rich audio experience while playing games and watching multimedia content.

The device offers a wide range of connections thanks to its dual USB-C ports. While these ports provide fast data transfer and charging, they also enable compatible operation with various peripherals. The rear fan system increases the cooling performance of the device, ensuring that the device remains cool even during long gaming sessions.

Intel opens the doors to a new era in the graphics processor market. With its new GPU series, which the company names with letters instead of numbers, Intel Arc B580 And B570 It reveals the power of the Xe2 architecture by introducing its models.

Although the Intel Arc B580 and B570 are based on the same BMG-G21 chip, they are released in different configurations. While the B580 model stands out with 20 Xe2 cores and 12 GB VRAM, the B570 model offers 18 Xe2 cores and 10 GB VRAM. These models, with bus widths of 192 bits and 160 bits respectively, provide 456 GB/s memory bandwidth in the B580 and 380 GB/s memory bandwidth in the B570.

• Arc B580
  • Price: 250 USD
  • Sunflower seed: 20 Xe2
  • VRAM: 12GB
  • Data Bus: 192 bits
  • Memory Bandwidth: 456GB/s

• Arc B570
  • Price: 220 USD
  • Sunflower seed: 18 Xe2
  • VRAM: 10GB
  • Data Bus: 160 bits
  • Memory Bandwidth: 380GB/s

Both models work with a single 8-pin power connector and have TDP values ​​​​ranging from 150 W to 180 W. While the B570 offers a more economical option with lower clock speeds and lower TDP, the B580 is ideal for users who require higher performance.

Intel Arc B580 costs an average of 24% more compared to its predecessor Arc A750 at the same price point. fast It offers performance. According to Intel’s own tests, the B580 model outperforms the Nvidia RTX 4060 by 10%. The fact that the RTX 4060 has 8 GB VRAM and is slightly more expensive makes the price-performance ratio of the B580 even more attractive.

Xe2 Architecture: Smaller Chip, Higher Performance

The new Xe2 graphics architecture has a smaller structure compared to the ACM-G10, with 19.6 billion transistors on the BMG-G21 chip. This allows for higher performance with a more compact chip. Xe2 cores run 70% faster and more efficiently at full speed, while offering 50% higher performance per watt. Additionally, new X Matrix Extensions (XMX) AI engines improve graphics rendering capabilities by accelerating ray tracing.

By introducing XeSS 2 along with the Xe2 architecture, Intel offers super resolution (image upscaling) as well as frame rendering and low latency features. These innovations are a response to Nvidia’s DLSS and Reflex technologies. F1 24 will be the first game to support XeSS 2, with nine more games to follow soon. Supported games include:

• Assassin’s Creed: Shadows
• Harry Potter: Quidditch Champions
• RoboCop: Rogue City
• Like a Dragon: Pirate Yakuza in Hawaii
• Dying Light 2 Stay Human
• Rising
• Marvel Rivals
• Massacre Floor 3
• castles

Intel Arc B580 will be available on December 13. A special Limited Edition version of this model comes with a dual fan cooling system. Brands like Acer, Asrock, Gunnir, Maxsun, Onix and Sparkle, among other manufacturers, will be releasing their own Battlemage cards. The more affordable Arc B570 model will go on sale on January 16.